The author is bullish on Intel, arguing that High-NA EUV and reticle stitching are technically derisked and could support improved fab returns; stitching may be ready for volume production as early as 2027. They criticize TSMC’s approach, saying its larger-mask alternative is complex and projected for production by 2033, while the quoted post says TSMC plans backside power with A16 and has not committed to High-NA EUV.