I’m surprised people are that skeptical of 3D dram. There has been a lot of research from China & Chinese companies like Alibaba showing it was pretty robust to thermals + higher BW. The logic does need to be codesigned specifically for the memory IP though so this might be why it wasn’t quickly adopted in the U.S. Unfortunately too busy next few days but do your googles. This is something Claude gets wrong until you correct it lol.
