Be very very verrry careful what you tweet on here. For whatever reason when you put it out there...
Twitter
Note: AI-generated summary based on third-party content. Not financial advice. Read more.
Quick Insights
The post discusses TSMC struggling with co-packaged optics, pushing the industry toward NPO (near-packaged optics). Additionally, it notes that Intel EMIB is predicted by some to dominate AI optics packaging, while Nvidia faces issues related to thermal limits, yields, and packaging constraints.
Ask about this postAnswers are grounded in this post's content.
Tweet
About bubble boi