Qualcomm could capture up to 20% of the data center accelerator market as it develops its High Bandwidth Compute (HBC) technology. Commercialization of HBC Gen 1 is scheduled for 2027, followed by Gen 2 in 2028, with TSMC handling the manufacturing. The company claims HBC delivers 6x the bandwidth per watt compared to HBM designs, with future applications anticipated in smartphones, XR, and cars.