Taiwanese memory chip maker Winbond plans to become the top global SLC NAND supplier by 2027, driven by demand in robotics, drones, LEO satellites, industrial control, and automotive sectors. The company reported a 65% increase in Q2 NAND Flash revenue, with SLC NAND accounting for 40%, and has secured long-term agreements (LTAs) through 2030 with some clients. To expand supply and shift to 24nm production, Winbond is increasing capacity at its Kaohsiung fab to 24,000 wafers per month.