HSBC reports that Intel ($INTC) is collaborating with Nvidia ($NVDA) on a next-generation 4-tile GPU package, potentially utilizing Intel's EMIB technology as an alternative to TSMC ($TSM) CoWoS, which is reportedly facing low yields on the Vera Rubin variant. Supporting data shows Intel Foundry has secured future projects with Google, Apple, and Terafab (a Tesla, SpaceX, and xAI joint venture) for 14A and 18A manufacturing processes. Consequently, HSBC has significantly raised its Wafer Fab Equipment (WFE) forecasts, projecting a rise to $272 billion by 2030.