TSMC is targeting 2029 for the mass production of CoPoS, a panel-level AI chip packaging technology designed to improve usable area and lower costs compared to current circular wafers. This technology is positioned as the successor to the current CoWoS platform used for high-end AI chips. Near-term investment implications focus on Taiwan packaging equipment and materials suppliers, with pilot lines reportedly established at VisEra’s Longtan plant and AP7 in Chiayi.