Meta is developing custom AI silicon, including the MTIA 400, MTIA 450 (early 2027), and MTIA 500 (late 2027), utilizing a chiplet architecture to accelerate design cycles to 6 months. These chips are being developed in partnership with Broadcom and will be fabricated by TSMC on a 3nm process node. The MTIA 500 is specifically designed for GenAI inference, featuring 384–512 GB of HBM capacity and 10 PFLOPs of FP8 performance.