Samsung Electronics is preparing for the mass production of 7th generation 10nm class (1d DRAM) as early as the first half of next year, with equipment introduction targeted for Q2 or Q3 2025. This advancement allows the company to increase production capacity with minimal additional capex by extracting more capacity per wafer. The 1d DRAM technology will serve as the core die for 9th generation high bandwidth memory (HBM5E), which is slated for commercialization in 2029.