NVIDIA is reportedly testing Intel EMIB packaging for its Feynman platform and conducting early tests on the Intel 18A process node. Potential revenue for Intel ($INTC) is estimated at $4.8 billion if used only for I/O die packaging, potentially scaling to $60–$80 billion for full Feynman production and over $100 billion when including TPU packaging. Future production may also utilize the Intel 14A node for TPU and NVIDIA I/O dies.