The post suggests that Intel and its EMIB technology are positioned to dominate AI optics packaging as TSMC faces yield and thermal limitations with its CoWoS process. These technical bottlenecks in Co-packaged optics are reportedly pushing Nvidia toward Near-Packaged Optics (NPO) solutions. The analysis highlights that thermal management and substrate integration remain the primary hurdles for scaling AI hardware components like switch ASICs and XPUs.