Intel (INTC) is reportedly accelerating its foundry business revival through large-scale investments in advanced semiconductor packaging, specifically its proprietary EMIB technology and Intel 18A process. The company has placed billions in purchase orders for materials, components, and equipment (MCE), with full-scale operations and significant revenue growth expected to begin next year. Key production hubs for these investments include the U.S., Vietnam, and Malaysia, aimed at competing with TSMC for advanced chip foundry customers.